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Hybrid RF Circuit Board 5-Layer High Frequency PCB Built on 10mil RO4350B and FR-4

(Printed circuit boards are custom-made products; the images and parameters shown are for reference only)


Introduction

Hello Everyone,
Warm greetings!
Today, we are excited to introduce a 5-layer PCB constructed from a combination of high-frequency RF material, RO4350B, and epoxy glass FR-4. This board is specifically designed for 2.4 GHz antenna applications. It has a thickness of 1.0 mm and features through holes. Both sides are covered with a green solder mask, and the pads are finished with immersion gold. These boards are fabricated according to IPC 6012 Class 2 standards using the provided Gerber data. Each batch consists of 25 boards, which are packed for shipment.



The above diagram illustrates the stack-up. “Layer 2” is etched away, leaving five layers of copper on the board.


Features and Benefits

1)Enhanced Signal Integrity: Improved performance compared to stack-ups made entirely from FR-4.
2)High Production Capacity: Our facility boasts a capability of 30,000 square meters per month.
3)Diverse PCB Types: We can produce 8,000 different types of PCBs each month.
4)Efficient Design Review: Quick CAD/CAM checking and free PCB quotations are available.
5)Flexible Order Quantities: No minimum order quantity (MOQ), making it cost-effective for prototypes and small runs.
6)Quality Standards: Adheres to IPC Class 2 and IPC Class 3 standards.



Applications

This versatile PCB is suitable for a wide range of applications, including:

consumer electronics;
Wi-Fi antennas;
8 port switches;
embedded computer DC transformers;
inverter systems;
Wi-Fi 4G routers;
temperature modules.


Parameter and Data Sheet

Click to expand/collapse the table

PCB SIZE

159.12 x 39.78mm=1PCS

BOARD TYPE

Hybrid Multilayer PCB

Number of Layers

5 layers

Surface Mount Components

YES

Through Hole Components

YES

LAYER STACKUP

copper ------- 18um(0.5oz)+plate TOP layer

RO4350B 10 mil (0.254mm)

Prepreg 0.12mm

copper ------- 35um(1oz) MidLayer 1

FR-4 0.152mm

copper ------- 35um(1oz) MidLayer 2

Prepreg 0.12mm

copper ------- 35um(1oz) MidLayer 3

FR-4 0.152mm

copper ------- 18um(0.5oz)+plate BOT layer

TECHNOLOGY

 

Minimum Trace and Space:

5 mil / 5 mil

Minimum / Maximum Holes:

0.4 mm / 5.0 mm

Number of Different Holes:

7

Number of Drill Holes:

81

Number of Milled Slots:

2

Number of Internal Cutouts:

0

Impedance Control:

no

Number of Gold finger:

0

BOARD MATERIAL

 

Glass Epoxy:

FR-4 Tg130℃, er<5.4; RO4350B Tg280℃, er < 3.8

Final foil external:

1 oz

Final foil internal:

1 oz

Final height of PCB:

1.0 mm ±0.1

PLATING AND COATING

 

Surface Finish

Immersion gold (14.6% ) 0.05µm over 3µm nickel

Solder Mask Apply To:

TOP and Bottom, 12micron Minimum

Solder Mask Color:

Green, PSR-2000GT600D, Taiyo Supplied.

Solder Mask Type:

LPSM

CONTOUR/CUTTING

CNC Routing

MARKING

 

Side of Component Legend

TOP and Bottom.

Colour of Component Legend

White, IJR-4000 MW300, Taiyo brand

Manufacturer Name or Logo:

Marked on the board in a conductor and leged FREE AREA

VIA

Plated through hole(PTH), minimum size 0.4mm.

FLAMIBILITY RATING

UL 94-V0 Approval MIN.

DIMENSION TOLERANCE

 

Outline dimension:  

0.0059"

Board plating:

0.0029"

Drill tolerance:

0.002"

TEST

100% Electrical Test prior shipment

TYPE OF ARTWORK TO BE SUPPLIED

email file, Gerber RS-274-X, PCBDOC etc

SERVICE AREA

Worldwide, Globally.



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